The BA385P1-V / BA385P2-V models were specially developed for fast and high precision assembly of small and medium batches. These models are equipped with an optical alignment system that allows image processing directly in the positioning head “Vision on the Fly”. It ensures optimal measurement of SMD components such as 0201, SOIC, PLCC, BGA, uBGA, CSP and QFP, as well as irregularly shaped components down to a grid of 0.3 mm.
Using a sophisticated camera and prism mechanism, components up to 16×14 mm are measured directly in the head. This eliminates the trip to the stationary camera.
Components larger than 16 x 14 mm are measured with an optional “bottom view” camera. Components up to 150×100 mm are accepted.
The removal area can be equipped with any number of different feed units. From auto tape feeders to IC trays.
Different methods are available for programming. Tailored to your needs, using Teach-In or CAD conversion. Of course, a barcode system can also be used.
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