AUTOTRONIK | BA389P3 | SMD – PICK & PLACE MACHINE

Details

TheBA385P1-V and BA385P2-V models were specially developed for fast, high precision assembly of small to medium batches. These models are equipped with an optical alignment system that allows image processing directly in the “Vision on the Fly” positioning head.Itensures optimal measurement of SMD components such as 0201, SOIC, PLCC, BGA, uBGA, CSP and QFP, as well as irregularly shaped components down to a 0.3 mm grid.

Alignment “in the air”

Using a sophisticated camera and prism mechanism, components up to 16×14 mm are measured directly in the head. This eliminates the trip to the stationary camera

.

Large components

Components larger than 16 x 14 mm are measured with an optional “bottom view” camera. Components up to 150×100 mm are accepted.

Flexible Equipment

The extraction area can be equipped with any number of different feeders. From automatic belt feeders to IC trays.

Easy to Program

Different methods are available for programming. Tailored to your needs, using Teach-In or CAD conversion. Of course, a barcode system can also be used

.

SPECIFICATIONS

BA389P-F3-V

• Number of heads (Vision on air): 3
• Placement speed: 12000 cph, 10500 cph (IPC 9850)
• Feeder capacity (8mm): Up to 160 Tape Feeder
• IC Tray capacity: Up to 3 Waffle Trays
• Component sense: vision detection
• Component size:
  • Camera head handling
• Resolution:
  • X/Y axis: 0.005mm
  • Z axis: 0.01mm
  • Rotation: 0° bis 360° (0.09°/step)
• Placement Accuracy: +/- 0.03mm
• Repeatability: +/- 0.01 mm n
• Placement area with/without conveyor:
• Without Waffle Tray: 650x460mm
• Programming:
• Direct input
• Teach-In by camera
• CAD access (option)
• Barcode reader (option)
• Industrial PC with WIN 10
• Power Supply: 230VAC
• Power: 3800W
• Pressure: 75 psi (5.5 bar), max. 300l/min
• Machine Size: 1300x1420x1460mm
• Weight: 1100kg
• * We reserve the right to make changes without prior notice.