MatriX | X3 | Automatic In-Line X-Ray Inspection

X3 In-Line X-ray / 3D X-ray and Transmission Inspection System

In-line X-ray inspection system for combined 3D X-ray and transmission analysis of double-sided PCBs with high density. Uses the universal standard system based on the motion concept of the AXI X2.5 matrix system with 360° shooting angle coverage. New 3D reconstruction software features detailed, high-resolution image generation.

X3 3D High Resolution In-Line X-Ray Inspection System

The X3 offers a flexible approach to solder joint inspection on a double-sided PCB. Through the intelligent CAD compiler, the PCB is divided with an automated inspection strategy based on non-overlapping regions. In the non-overlapping regions, you have 2D transmission views. In the overlapping regions, patented filter technology (SFT) can be used to separate the overlapping components or the 3D reconstruction technique called 3D-SART. 3D-SART enables image sets across the entire top assembly with the highest resolution available on the market.

Key Features

• Flexible inspection techniques (2D, 2.5D, 3D)
• Off-Axis Imagin (2.5D) specific for BGA devices to check Head-In-Pillow (HIP) or Head-on-Pillow (HOP) and barrel fill detection of Pin-in-Paste or THT connectors
• 3D Simultaneous Algebraic Reconstruction Technique (3D-SART) producing industry leading image resolution

X-Ray System Features

• High Resolution 130kV X-Ray Tube
• 2k x 2k with digital flat panel detector in xy-axis motion system
• 5-axis programmable algebraic motion reconstruction system for 3D analysis (SART)
• MIPS inspection platform for off-line programming, analysis and verification. Inclusion of a modular test algorithm library for joint inspection welding

Applications

• Double-sided PCBs with high density and hidden solder joints
• Power components with heat sinks
• All standard SMD’s and THT/PTH components
• Specific BGA and QFN applications
• MCM modules
• Cooling / heatsink boards without inspection