MatriX | X2.5L | Automatic In-Line X-Ray Inspection

X2.5L Automated X-ray System for High-Speed Final Inspection

Automated inspection system designed for high-speed final inspection of printed circuit boards and complete assemblies.

The X2.5L is based on MatriX’s X2.5 systems. It is configured with a new generation of TDI X-ray cameras that provide high speed, high sensitivity and high resolution. The configuration of the X2.5L allows the inspection of complete PCBs with only a few scans. In addition the X2.5L array is equipped with additional CMOS X-ray detectors in a separate U/V stage. This allows high-speed off-axis imaging from different angles and directions, with the highest image quality and resolution.

X-Ray System Features

• High speed AXI System up to 400 mm/sec (Line Scanner)
• Wide angle Micro Focus X-Ray (Sealed), 130 kV / 40 W
• High speed TDI camera readout (Line Scanner)
• Scanning width up to 100 mm
• Additional CMOS X-Ray Detector (12 x 7 cm, 14 bit digital output, 2k x 2k)
• Programmable 5-axis motion system with X/Y sample table and CMOS detector on U/V motion axis
• Grayscale and automatic geometric calibration
• Bar code scanner (1D/2D) for serial number and product type selection

Applications

• All standard SMD and THT/PTH components
• Specific BGA and QFN algorithm
• Off-axis image analysis of BGA, THT
• Cooling plates and heatsink without inspection
• Assembly Completion Testing
• Final Product Quality Testing