MatriX | X2.5 | Automatic Inline X-Ray Inspection

X2.5 Automatic In-Line X-Ray Inspection (Transmission, 3D-SFT, Off-Axis)

Automated inspection system designed for sophisticated high-speed inspection in SMT production. X-ray transmission technology with patented Slice-Filter-Technique (SFT) and Off-Axis. This technology presents a reliable solution for in-line inspection of double-sided PCB assemblies. The X2.5 moving detector axes enable high-speed off-axis image acquisition from different angles and directions, with the highest image quality and resolution.

The X2.5 accurately identifies (HIP) defects in Head-in-Pillow.

The use of Off-Axis Imaging (2.5D) coupled with our industry leading off-axis algorithms, allows BGA’s proprietary measurement to extract unique signatures from each image. It has the highest defect detection rate.

The X2.5 detects Pin-in-Paste and THT barrel-filled connectors.

Using Off-Axis Imagin (2.5D) technology along with an advanced THT inspection library, the X2.5 can measure and fill the compute barrel through the entire barrel, as well as the top side and bottom side of the connector independently.

X-Ray System Features

• 130kV / 40W wide Microfocus X-RAY (sealed) tube
• Programmable 5-axis motion system with linear drive example table for high-speed inspection mode
• CMOS Digital flat panel u/v installation detector and motion system (14 bit digital output, 2k x 2k
• MIPS inspection platform for offline programming, analysis and verification. And the inclusion of a modular test algorithm library for joint inspection welding.

Applications

• All standard SMD`s and THT/PTH components
• Specific BGA and QFN algorithms
• PTH/THT with barrel fill measurement
• Cooling plates and heatsinks without inspection