Flying Probe Test Equipment

The SPEA series of mobile probes is designed to cover the widest range of test requirements for electronic boards. High mechanical speed, single or double-sided probing, extreme precision, automatic board loading, global configurability and fast setup changes: the performance and flexibility of the SPEA moving probe offer you everything you need to respond adaptively to your production needs.

Extreme mechanical precision allows moving probes to directly contact the smallest pins of micro-SMD packages. The mechanical performance is then supported by high-resolution, on-axis measurement electronics that enable ultra-precise measurements, even reducing measurement acquisition time to a few microseconds.

An innovative multi-process platform enables the simultaneous performance of multiple test techniques, optimizing the test program, which combines In-Circuit test (powered or not), short-circuit test, optical inspection, Boundary Scan Test, functional tests and more. All these functions are complemented by an intuitive yet powerful software environment.