XCEED The Ultimate 3D AOI | 3D SPI Paste Inspection

New 3D AOI Technology

• New generation 3D AOI
• Simultaneous 2D and 3D inspection
• 3D image
• Laser sensor head with contrasted technology
• High speed / High accuracy / No vibration
• Very low false failure rate
• Easy maintenance and operation
• Xpert – Communication with SPI

AOI 3D

Laser scanning method

Industry’s Fastest Inspection

Real 3D Imaging

Inspection Irrelevant to Color, Material, Surface relief

Inspection possible up to 65mm height

Foreign material & contamination, PCB deformation, inspection without additional cycle time

Inspection Items

Dimension, Missing, Misalignment, Bad, Side Mount, Tombstone, Text (OCR/OCV), Solder, Lead Lift, Lead Missing, Lead Displacement, Bridge, Color Band, Pin, Coplanarity, etc.