Parmi

XCEED MP – 3D AOI | 3D paste inspection

Reference: XCEED-MP

 

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AOI 3D Multi Purpose

 

Inspection of components, soldering and coating with a single machine

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Scanning method Laser Line Scan

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Foreign material and Contamination, PCB deformation, inspection without additional cycle time

 

Type of application software according to user’s needs (SPI/AOI/CCI)

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Element Inspección

SMD, Solder Paste, Epoxy, Varnish, etc.

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