Machine design
The ASSCON vacuum brazing process combines the vapor phase with the vacuum process. The vacuum module consists of the evacuation unit mounted in the process chamber, secured with quick-release fasteners for fast and easy removal for maintenance. Pump, valves and sensors are integrated in the base.
Atypical applications
VP2100-100
The soldering chamber has been enlarged to 750 x 620 mm. Both smaller assemblies up to a load of four in the batch and larger assemblies up to the maximum size of the soldering chamber can be processed.
Transportation type: Single Lane
Maximum solder format: up to 750 x 620 mm
Maximum PCB length – 2 PCB loading: up to 370 mm
Maximum PCB length – 3 PCB loading : up to 235 mm
Maximum PCB length – 4 PCB loading: up to 165 mm
Maximum component height at top: 60 mm
Connection load: 9 ,6 kW
Time to operation ca. 30 min
VP2100-100 vacuum
Optionally, the system can be equipped with the patented Multi Vacuum technology. A vacuum module that can be switched on during the process reduces the voids in the solder joints and is extremely low in maintenance. The vacuum module can also be retrofitted.
Transportation type: Single Lane
Maximum solder format: up to 620 x 520 mm
Maximum PCB length – 2 PCB loading: up to 290 mm
Maximum PCB length – 3 PCB loading : up to 180 mm
Maximum PCB length – 4 PCB loading : up to 125 mm
Maximum component height at top: 60 mm
Connection load: 15,5 kW
Time to operation: ca. 60 min
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