PARMI SIGMAX | 3D Paste Inspection

Parmi’s SigmaXs older paste inspection system provides innovative, industry-leading performance to add value to your business.The latest in measurement technology, coupled with the industry’s fastest cycle times and unique process support tools, maximizes your return on investment and your profit.

• Dual laser technology eliminates shadowing.
• Compatible with all PCB colors, finishes and HASLs.
• Identifies all features, including bores, vias, board edge and crimps.
• Inspection speed of 100?/sec at 10×10 micron resolution, as well as immediate access to results, provides the best performance in the industry.
• High respectability and accuracy with height measurements of +/- 1mm

RSCVII 3D sensor features.

• Inspection speed increased by 25~30% with respect to the RSCVI.
• Sigma X: 100?/sec at 10×10 microns
• Sigma X Blue: 60?/sec at 10×10 microns. Real-time measurement and control of plate buckling.
• Real 3D shape and 2D image.

Sigma X specifications and dimensions.
Maximizing plate size with minimum plant usage.

nThe SigmaX offers a wide range of features, including machine intelligence focused on identifying and eliminating defects at their root cause.
Process analysis tools, powerful Statistical Process Control utilities, and closed-loop communications to processes up and down the line, all designed to solve problems and make your life easier. Parmi systems are synonymous with high quality design, materials and workmanship. Only the highest quality components have been included in the SigmaX. All sub-systems are accessible for easy maintenance.

3D SPI

Laser Scanning Method

Industry’s Fastest Inspection

Real 3D Imaging

Inspection irrelevant to color, material, surface relief

Automatic PCB Buckling / Strain Measurement

Automatic PCB Stretch and Shrinkage Compensation

Process optimization with feedback & feedforward information.

Inspection Items

Height, area, volume, displacement, bridge, shape, PCB deformation, PCB shrinkage, etc.