Dage | BondTester 4000 Optima | Bondtest equipment for microelectronics

4000 Optima Bondtester The fastest, most accurate bondtester. The Nordson DAGE 4000 Optima is optimized for fast, accurate and reliable bond testing in the volume manufacturing environment. The combination of patented technology and ergonomics with intelligent and intuitive software makes the Optima 4000 the premier production bond tester, with repeatable and reproducible results.

Fast testing
Maximize your throughput with the fast loading tool.

Ultra-fast application changes
Nordson DAGE’s in-depth knowledge of bond testing in the volume manufacturing environment favors the uncompromising development of the industry’s only multi-function cartridge (MFC) cartridge. The uniquely designed MFC extends the versatility of manual testing on the Optima 4000, enabling ultra-quick application transition – within seconds.

Superior accuracy
Obtain repeatable and reproducible results, which are guaranteed and qualified with MSA and GR&R studies.

Maximum flexibility
Perform pull tests from 0.25 grams to 50 kilograms and Shear testing from 0.25 grams to 200 kilograms.

Intelligent Software
The software it uses is the Paragon 4000 Optima™, which features a highly configurable and intuitive interface, as well as a wide variety of advanced features such as automatic GR and R calculation, a diagnostic function, a unique search engine wizard and superior database reporting.

Test Types

Bal lShear/Solder Ball Shear

Cavity Shear

Cold Bump Pull

Die Crush

Die Shear

Fatigue/Push-Pull

First Bond Ball Pull/Stud Bump Pull

High Force Pull

High Strain Rate Pull nHot Bump Pull

Overhanging Die

Passivation Layer Shear

Ribbon

Peel Pull Ribbon Pull

Stu dPull

Tweezer Pull

Vector Pull

Wedge Shear

Wire Pull

ZoneShear