Interflux

Interflux | LMPA Low Melting Point Lead-Free Soldering Paste

Reference: IFSPQ7RLMPA-QT4
 42.00 VAT not included
Vapor phase soldering
Stencil printing
Solder paste jetting
Rosin based (colophony)
RoHS compliant
Reflow soldering
Reduced production cost
No Clean - no post cleaning needed
Low voiding
Low soldering temperatures
Low melting point soldering (LMPA)
Lead-free
Increased mechanical reliability
For "J-legs" and "Seagull Wings" BGAs
Enhanced low melting point solder paste
Dispensing
Completely halide-free

~LMPA™

– Q Advantages LMPA™ the INTERFLUX® Low Melting Point Alloys

√ Environmentally friendly

√ Cost reduction

√ Increased reliability

Environmentally friendly:

  • Significant reduction (15-20%) of CO2 generated due to less electricity consumption
  • Less alloy waste due to very low amount of slag caused by oxidation

Cost reduction through:

  • significant reduction (> 90%) of oxide formation in wave soldering processes
  • no need for N2 in reflow and wave soldering processes
  • lower electricity consumption bills due to lower process temperatures (15-20%)
  • absence of costly silver (Ag) in LMPA™ – Q alloy
  • higher first pass performance
  • fewer temperature induced components and board damage

Higher reliability:

  • Outperforms SAC305 in thermal cycling tests
  • Outperforms SAC305 in elongation and yield strength tests
  • Outperforms SAC305 in destructive vibration tests

Superior microstrain behavior compared to SAC305.

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