Share

SMT Hybrid Packaging 2020 – 28th-30th July

SSMT Hybrid Packaging takes place at the Nürnberg Messe Nuremberg from 5th to 7th May 2020

SMTconnect (formerly known as SMT Hybrid Packaging) is the only event in Europe that brings together people and technologies from the areas of development, production, services and applications in connection with microelectronic assemblies and systems.

This event provides an ideal environment for sharing ideas within the electronics community, developing customized solutions for electronic assemblies and systems, laying the groundwork for commercial agreements and honing their expertise.

Parallel to the SMTconnect trade show, the recently launched SMTconnect Technology Days will bring together assembly and connection technologies from a wide variety of user sectors. Over three days, seminars and special sessions will address all practical aspects of soldering, adhesive and substrate technologies.

https://smt.mesago.com/nuremberg/en.html