The Axiom X-1010 dispensing system meets midrange throughput requirements for inline, highvolume, high-accuracy SMT application of surface mount adhesive (SMA), solder paste and electrically conductive adhesive applications. The system keeps pace with placement equipment in the 30,000 components-per-hour range. Configured with the patented DJ-2100 DispenseJet® valve for non-contact jetting, the system delivers precise dot volume repeatability without use of mechanical needle standoffs.

When dispensing solder paste and conductive adhesives, Asymtek’s DV-7000 Heli-flow™ pump provides fast, repeatable dispensing of mediumto high-viscosity materials using standoff nozzles and a floating head. Its light-touch contact,

coupled with under-board support, provides precise z-axis positioning for fast, accurate smalldot dispensing for dot diameters below 0.5 mm.

Built directly into the dispense head, the Dynamic Dispensing Control™ (DDC) microcontroller provides precise control of pump operation. In addition, incorporation of a new communication bus structure provides increased control and future expansion for new applications.

The standard Axiom system is configured with the latest version of Asymtek’s Fluidmove® for Windows NT® (FmNT) software. With the CAD Import software utility, Fluidmove programs can be quickly and efficiently developed offline using existing CAD-generated data, or a file from a component placement machine.